WAFER PROCESSING CAPABILITIES

Our process engineering staff at STB-Advaplan have an extensive background in edge trimming, wafer thinning, CMP and polishing of a broad range of materials and applications, including:

• SOI
• MEMS
• MOEMS
• Photonics
• Thin Film Heads
• Semiconductor
• III-V
• Silicon
• LED
• SiC
• Sapphire
• 3D-IC
• TSV
• BSI 

To learn more about the solutions STB-Advaplan can provide, contact us or request a quote. 

SERVICES

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By Phone: 1-805-782-5431

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